发明名称 ADHESIVE COMPOSITION AND ADHESIVE TAPE OR SHEET
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition which yields an adhesive which may be applied without any inorganic solvent and shows a good corrugated board-sealing property at low temperatures, and provide a tape or a sheet to which the composition is applied. SOLUTION: This adhesive composition contains an acrylic emulsion polymer comprising a monomer mixture comprising from 60 to 98 wt.% (meth)acrylic monomer of formula (1): CH2=C(R1)COOR2, from 2 to 6 wt.% carboxyl group- containing vinyl monomer and from 0 to 38 wt.% functional group-containing vinyl monomer copolymerizable with these main monomers, which is obtained through emulsion polymerization using a monoalkyl succinate sulfonate as an emulsifier and has a gel percentage of from 46 to 58%, a weight average molecular weight of the sol content of >=500,000 and a glass transition temperature of from -75 to -55 deg.C.
申请公布号 JP2001316652(A) 申请公布日期 2001.11.16
申请号 JP20000137972 申请日期 2000.05.11
申请人 NITTO DENKO CORP 发明人 KAMIYA KATSUHIKO;CHARLIE MATHIEU;UMEDA MICHIO
分类号 C09J7/02;C08F2/26;C08F220/18;C09J133/06;(IPC1-7):C09J133/06 主分类号 C09J7/02
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