| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem in which a semiconductor wafer is deteriorated in manufacturing yield or in product uniformity when the semiconductor wafer is polished by the use of a conventional vacuum chuck due to the fact that the semiconductor wafer is liable to be polished at it holds sloping, or a sag occurs at the peripheral circumference of the semiconductor wafer after polishing. SOLUTION: A vacuum chuck is equipped with a cup-shaped vacuum chuck base through a vacuum air system and an air bag system, a guide ring provided along the outer edge or the vacuum chuck base, a movable means provided to the vacuum chuck base, an impervious ceramic plate internally provided, and a recessed part provided to the ceramic plate and communicating with the vacuum air system. An air bag communicating with the air system is interposed between the vacuum chuck base and the ceramic plate. |
