| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing device which is lessened in structure size and capable of carrying out continuous processing. SOLUTION: This wafer polishing device holds a wafer (W) with a carrier plate (9) and moves the carrier plate (9) on a platen with a weight (8) on it, by which the wafer (W) is continuously polished. The polishing device is equipped with the platen (2) rotating in one direction, a center guide plate (3) rotating independently of the platen (2), and guide rollers (4) disposed at regular intervals outside the platen (2). The guide rollers (4) are disposed in a rotatable manner independently of the platen (2) along the outer circumference of the platen (2). |
