| 摘要 |
PROBLEM TO BE SOLVED: To finally make the quantity of developing liquid supplied on a substrate uniform over the substrate surface in a developing process for the substrate. SOLUTION: A long and narrow developing liquid supply nozzle 75 that supplies the developing liquid by moving on a wafer W is arranged in the developing apparatus. In this developing liquid supply nozzle 75, a plurality of supply openings 85a-85k are arranged in line in the longitudinal direction, and the diameters of these supply openings 85 are gradually larger in the order from the supply opening 85a to the supply opening 85g while the diameters of the supply opening 85g to the supply opening 85k are the same. Besides, the moving route of the development liquid supply nozzle 75 is so established that the supply opening 85b passes over the central part of the wafer W. By these arrangements, the quantity of the developing liquid supplied on the central part of the wafer W is reduced, and the quantity of the developing liquid supplied on the surface of the wafer W is finally made uniform. |
