| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for forming an etching resistant resin layer which perfectly fills an ostium opening pattern formed in a metal sheet and does not leave bubbles in the ostium opening pattern, that is, which does not proceed an anomalous etching, and to provide a method for manufacturing a shadow mask using the forming method. SOLUTION: This process includes forming the etching resistant resin layer 7 on a metal sheet in which a half etching was carried out, by peeling off a base film, a cushion layer, and a resin peel layer, after sticking a transfer sheet in which the cushion layer, the resin peel layer, and the etching resitant resin layer are laminated on one side of the base film, to the metal sheet 1 in which the half etching was carried out. The method includes producing a shadow mask by using the forming process.
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