| 摘要 |
<p>An elastomer composition which contains an extremely clean filler reduced in both water generation and organic outgassing and is suitable for use as a molding material for semiconductor production apparatuses; and a crosslinked molding of the composition. The composition is a crosslinkable composition comprising a polymer, especially a crosslinkable fluoroelastomer, and a filler having a weight loss through 2-hour heating at 200°C of up to 2.5x10-5 wt.% per m2 of the surface area and having a total amount of organic gases generated through 15-minute heating at 200°C of 2.5 ppm or smaller.</p> |
