SEMICONDUCTOR DEVICE MOUNTING CIRCUIT BOARD, METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING MOUNTING STRUCTURE USING THE SAME

摘要

A semiconductor mounting structure which does not cause characteristic degradation of semiconductor devices, wire breakage of wiring, or the like during mounting of semiconductor devices on circuit boards. A mounting structure comprising a circuit board with a semiconductor device mounted thereon, wherein a projecting electrode of the semiconductor device is arranged on the input/output terminal electrode of the circuit board and bonded thereto for electric and mechanical connection by a conductive adhesive, and the semiconductor device and circuit board are fixedly bonded by a resin film preformed on the board surface. This enables mounting without causing damage to the semiconductor functional parts or wiring and with lower load than in the conventional anisotropic conductive film; therefore, high-productivity low-cost thermo-compression bonding mounting can be applied.