发明名称 |
METHOD AND APPARATUS FOR SPUTTER ETCH CONDITIONING A CERAMIC BODY |
摘要 |
A method and apparatus for conditioning a surface of a ceramic body in a process chamber when the process chamber has a vacuum pump, an anode and a cathode. The conditioning method consists of pumping the process chamber down to a vacuum with the vacuum pump, introducing a gas into the chamber, energizing the anode and cathode with RF power to ignite the gas into a plasma, sputter etching the surface with ions from the plasma to remove contaminants therefrom. The method is accomplished either within a process chamber to condition, in situ, a ceramic chuck or within a cleaning chamber to condition any form of ceramic body or component.
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申请公布号 |
US2001040091(A1) |
申请公布日期 |
2001.11.15 |
申请号 |
US19980159009 |
申请日期 |
1998.09.23 |
申请人 |
KHURANA NITIN;BURKHART VINCE;SANSONI STEVE;PARKHE VIJAY;TZOU EUGENE |
发明人 |
KHURANA NITIN;BURKHART VINCE;SANSONI STEVE;PARKHE VIJAY;TZOU EUGENE |
分类号 |
C04B41/80;C23C14/34;C23F4/00;H01J37/32;H01J37/34;H01L21/203;H01L21/205;H01L21/302;H01L21/3065;H01L21/683;(IPC1-7):C23C14/34 |
主分类号 |
C04B41/80 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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