发明名称 |
Film forming method and film forming apparatus |
摘要 |
A polyimide solution is supplied to a wafer and the wafer is rotated by means of a spin chuck, thereby forming a polyimide film on the wafer. An irradiator for irradiating a laser beam to a peripheral portion of the wafer W is provided. After the polyimide film is formed and side rinse is performed, a laser beam is irradiated to the peripheral portion to solidify the film at the peripheral portion. The solidified polyimide film forms a weir, thus preventing the polyimide solution which has not dried yet from flowing out toward a peripheral edge portion.
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申请公布号 |
US2001041229(A1) |
申请公布日期 |
2001.11.15 |
申请号 |
US20010905134 |
申请日期 |
2001.07.16 |
申请人 |
SAKAMOTO YASUHIRO;YAEGASHI HIDETAMI |
发明人 |
SAKAMOTO YASUHIRO;YAEGASHI HIDETAMI |
分类号 |
B05D1/00;B05D3/06;C08F2/48;H01L21/00;(IPC1-7):B05D3/12 |
主分类号 |
B05D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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