| 摘要 |
<p>A system for laser cutting brittle materials. In one aspect, the outer perimeter of a base plate of brittle material, which contains therein a workpiece defined by a laser micro-crack cut line, is heated. The heating causes the base plate material to expand away from the micro-crack cut line, therein expanding the interstice between the base plate and the workpiece, releasing the workpiece defined by the micro-crack cut line. Alternatively, a gas emitting tape is positioned under a micro-crack cut line and applies a force against the brittle material along the micro-crack cut line, therein propagating the micro-crack through the thickness of the material and completely separating the brittle material along the micro-crack cut line. Another aspect employs ultrasonic energy to cause breakage of a brittle material along a micro-crack scribe line. Yet another aspect employs the application of high pressure fluid along a micro-crack cut line, therein forcing the material on either side of the cut line apart. Still another aspect embodies the use of two beams of laser energy to create a laser beam incident composite footprint which efficiently creates stress vectors required to split brittle materials.</p> |
