COMPONENT OF PRINTED CIRCUIT BOARD

摘要

A method of forming a laminate (50) used in the manufacture of printed circuit boards, comprising the steps of applying a layer of chronium (18) having a thickness of about 30-160 grams per square meter to each side of a steel substrate (16) having a thickness from about 0.10-0.20 mm; applying a layer of copper (42) having a thickness from about 2-70 microns to each of the chronium layer (18); positioning the steel substrate (16) between two dielectric layers (72) with adhesive (74) disposed between the copper layers (42) and the dielectric layers (72); applying heat and pressure to the layers to bond the copper layers (42) to the dielectric layers (72); separating the steel substrate (16) from the copper layers (42); and discarding the steel substrate (16).