发明名称 Method of aligning features in a multi-layer electrical connective device
摘要 A method of constructing an electric apparatus, comprising the following steps. First, a set of dielectric layers is provided. Next, a set of conductive features and at least one fiducial marking are formed on a first one of the dielectric layers, in mutual reference to each other so that their relative positions are known to a first tolerance. Then, a set of pin holes is formed in each dielectric layer, each pin hole formed in relation to the fiducial marking for its dielectric layer and all of the sets of pin holes having a mutually identical placement. Finally the dielectric layers are arranged onto a pin fixture having a set of pins that match the mutually identical placement of the pin holes.
申请公布号 US2001039729(A1) 申请公布日期 2001.11.15
申请号 US20010909021 申请日期 2001.07.19
申请人 ROSS BENJAMIN B.;JORDAN PHILLIP L.;STROLE JEFFERY A. 发明人 ROSS BENJAMIN B.;JORDAN PHILLIP L.;STROLE JEFFERY A.
分类号 G01R31/26;G01R1/073;H01L23/498;H05K1/02;H05K1/11;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H05K3/30;H01K3/10 主分类号 G01R31/26
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