| 摘要 |
A microelectronic integrated circuit chip comprises a hexagonal semiconduct or die, a plurality of logic circuitries formed at the interior region of the semiconductor die, a plurality of drive circuitries formed at the peripheral region of the semiconductor die, a plurality of input/output bonding pads formed adjacent to the drive circuitries, and a network of electrical conductors arranged on a plurality of interconnect layers. The logic circuitries and the drive circuitries have boundaries and contacts generally angled at a multiple of pi/3 radian (60 degrees), and the electrical conductors on one interconnect layer are generally angled to the electrical conductors on another interconnect layer at a multiple of pi/3 radian (60 degrees), in order to provide high interconnect density and flexible routing . This invention relates to microelectronic integrated circuit chips, and t he principal use of the invention is for producing efficient microelectronic integrated circuits.
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