发明名称 |
SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATION OPENING |
摘要 |
A semiconductor package having a lead frame is provided in which the lead frame has a plurality of leads and a die pad for mounting a semiconductor die. The die pad is formed with at least one opening for exposing a portion of the surface of the semiconductor die. An encapsulant is formed to enclose the semiconductor die, portions of the leads and a portion of the die pad, while having a surface of the die pad to expose the form of the encapsulant. As a surface of the die pad is exposed to the exterior of the encapsulant, the opening formed on the die pad provides a thermal conduction path from the semiconductor die to the ambient, thereby enhancing the heat dissipation property of the semiconductor package.
|
申请公布号 |
US2001040300(A1) |
申请公布日期 |
2001.11.15 |
申请号 |
US19990360084 |
申请日期 |
1999.07.23 |
申请人 |
HUANG CHIEN-PING;LAI CHENG-YUAN |
发明人 |
HUANG CHIEN-PING;LAI CHENG-YUAN |
分类号 |
H01L23/433;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/433 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|