发明名称 |
Packaged semiconductor device and manufacturing method thereof |
摘要 |
A semiconductor chip is attached on a package substrate so as to be electrically connected to it and sealed. A ring member is attached to the package substrate and surrounds the semiconductor chip. A lid member is attached to the ring member and covers the semiconductor chip. The lid member is formed so as to be able to be removed from the ring member without impairing the attachment of the ring member to the package substrate.
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申请公布号 |
US2001040288(A1) |
申请公布日期 |
2001.11.15 |
申请号 |
US20000495906 |
申请日期 |
2000.02.02 |
申请人 |
MATSUSHIMA HIRONORI;TOMITA YOSHIHIRO |
发明人 |
MATSUSHIMA HIRONORI;TOMITA YOSHIHIRO |
分类号 |
H01L23/02;H01L23/10;H01L23/34;(IPC1-7):H01L29/40;H01L23/48;H01L23/52 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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