发明名称 BONDED LAYER SEMICONDUCTOR DEVICE
摘要 The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.
申请公布号 US2001040644(A1) 申请公布日期 2001.11.15
申请号 US19990465140 申请日期 1999.12.16
申请人 VU DUY-PHACH;DINGLE BRENDA D.;DINGLE JASON E.;CHEONG NGWE 发明人 VU DUY-PHACH;DINGLE BRENDA D.;DINGLE JASON E.;CHEONG NGWE
分类号 A61B3/113;G02B5/30;G02B27/00;G02B27/01;G02F1/1333;G02F1/1335;G02F1/1347;G02F1/136;G02F1/1362;G09G3/30;G09G3/32;G09G3/36;H01L21/77;H01L21/822;H01L21/84;H01L25/075;H01L27/06;H01L27/12;H01L27/15;H01L29/786;H01L33/00;H01S5/02;H01S5/42;H04N5/70;H04N5/74;H05B33/12;(IPC1-7):G02F1/136 主分类号 A61B3/113
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