| 摘要 |
<p>A multilayer wiring board (101) comprises: a metal substrate (102) as a core, a condenser dielectric layer (102a) formed to cover the metal layer (102) and a condenser electrode metal layer (104) formed to cover the condenser dielectric layer (102a), so that a condenser is defined by the metal substrate (102), the condenser dielectric layer (102a) and the condenser electrode metal layer (104). The condenser dielectric layer (102a) is provided with a first contact hole (102b) to communicate with the metal substrate (102) and the condenser electrode metal layer (104) is provided with a second contact hole (104b) to communicate with the first contact hole, the diameter of the second contact hole (104b) being larger than that of the first contact hole (102b). An insulating layer (111) is formed on the condenser electrode metal layer (104) and is provided with a via hole to communicate with the metal substrate through the second and first contact holes (102b,104b). A metal substrate contact metal layer (112a) is formed on an inner wall of the via hole, so that the metal substrate contact metal layer (112a) comes into electrical contact with the metal substrate (102). <IMAGE></p> |
