Multiple line grid for use in a packaging or a testing application

摘要

A multiple line grid for redistributing I/O pads from a peripheral array to an area array is disclosed. The multiple line grid includes a body having a top and a bottom surfaces, via holes, connection lines, upper bumps arranged in an area array and lower bumps arranged in tow peripheral/side arrays. Each of the via holes is provided with a first end exposed on the top surface and a second opposite end exposed on the bottom surface of the body. Each of the connection lines has a different length from the neighbouring connection lines. Each of the upper bumps is arranged to be in contact with the first end of the corresponding via hole. Each of the lower bumps is connected to the second end of the corresponding via hole through the corresponding connection line.