| 摘要 |
<p>A method and apparatus for cooling an integrated circuit device mounted face-down on a package such that the device may be optically probed. The method of the present invention includes the following steps: (1) placing an optically-transparent window over the integrated circuit device to form a channel bounded by the optically-transparent window and the integrated circuit device and (2) flowing an optically-transparent fluid through the channel to remove heat dissipated by the integrated circuit device. The apparatus of the present invention includes: (1) an inlet for receiving an optically-transparent fluid, (2) an optically-transparent window for placement over the integrated circuit device, (3) a channel bounded by the optically-transparent window and the integrated circuit device and coupled to the inlet for directing the optically-transparent fluid to flow over the integrated circuit device to remove heat dissipated by the integrated circuit device and (4) an outlet coupled to the channel for discharging the optically-transparent fluid from the channel.</p> |
