发明名称 |
SEMICONDUCTOR CHIP WITH BUMP CONTACTS |
摘要 |
A via 42 is formed by copper plating on a surface of an aluminum electrode pad 32 of a semiconductor chip 30. Since the via 42 having flexibility absorbs a stress generated due to a difference in thermal expansion between the semiconductor chip 30 and a substrate, the semiconductor chip 30 can be mounted onto the substrate 50 with high reliability and connection reliability of the semiconductor chip 30 can be enhanced. <IMAGE> |
申请公布号 |
EP1154471(A1) |
申请公布日期 |
2001.11.14 |
申请号 |
EP19990944862 |
申请日期 |
1999.09.27 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
ENOMOTO, R;YABASHI, H.;SUGIYAMA, TADASHI;HATADA, KENZO |
分类号 |
H01L21/60;H01L21/288;H01L23/31;H01L23/485 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|