| 摘要 |
The present invention relates to an ink composition for masking, upon gold plating that is carried out to improve conduction and corrosion resistance, on a cupper-plated layer at which a wiring portion on a printed circuit board is formed and a masking method using the ink composition. In particular, this invention relates to an ink composition for masking on a printed circuit board and a masking method using the ink composition wherein a portion on which a gold plating process is not required is masked with a protecting ink for a wiring plate on the printed circuit board in a screen printing manner and then, the gold plating process is carried out, whereby a plated film can be easily peeled off after gold-plating. |
