| 摘要 |
An interface circuit which can transmit signals at high speed in a back plane application, which, in turn, can transmit signals among multiple circuit substrates via the transmission lines on a back board. Card 52 of the present invention has input circuit 92, wiring 212, and clamping circuit 402. Wiring 212 is connected to the input of input circuit 92, and clamping circuit 402 is connected to wiring 212. A signal is transmitted from transmission line 3 on back board 2 to wiring 212 via socket 42. However, when the transmitted signal rises or drops significantly, the signal is clamped by clamping circuit 402 so that it will not go outside a certain voltage range. The vibration amplitude of the signal becomes small. Consequently, the time needed for the input potential of input circuit 92 to be stabilized can be reduced and signals can be transmitted at high speed.
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