| 摘要 |
The present invention provides a ceramic circuit board comprising: a ceramic substrate comprising ceramic crystal grains and liquid phase component grains; and a conductive layer to be formed as a circuit integrally formed to the ceramic substrate, wherein the ceramic substrate has a thermal conductivity of 180 W/m.K or more and the ceramic crystal grains have an average grain size of 10 mum or less. According to the structure described above, there can be provided a ceramic circuit board which has a high thermal conductivity of 180 W/m.K or more, an excellent heat radiating property and a high strength which is capable of reducing crack formation during the assembling and operation of the circuit board, and is capable of reducing short-circuit accident to be occurred in the conductive layer.
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