发明名称 HIGH RELATIVE PERMITTIVITY PREPREG
摘要 PROBLEM TO BE SOLVED: To obtain a high relative permittivity prepreg containing a ceramic finer cloth base material which excels in heat resistance, electrical properties after moisture absorption, adhesion to a copper foil and the like. SOLUTION: The high relative permittivity prepreg is manufactured by allowing a resin composition comprising 80-99 wt.% insulating inorganic filler powder having a relative permittivity at room temperature of >=500 to adhere to a ceramic fiber cloth having a relative permittivity of >=50, perferably >=500, and rendering the resulting cloth in the B-stage. Further, the high relative permittivity perpreg is manufactured with the use of a composition obtained by uniformly compounding a resin composition comprising (a) 100 pts.wt. polyfunctional cyanic acid ester compound and (b) 50-10,000 pts.wt. epoxy resin which is liquid at room temperature as the thermosetting resin and 0.005-10 pts.wt., based on a sum of components (a) and (b) of 100 pts.wt., thermosetting catalyst as the essential component with an insulating inorganic filler having a relative permittitity at room temperature of >=500 and a specific surface area of 0.3-1.00 m2/g.
申请公布号 JP2001316500(A) 申请公布日期 2001.11.13
申请号 JP20000132018 申请日期 2000.05.01
申请人 MITSUBISHI GAS CHEM CO INC 发明人 IKEGUCHI NOBUYUKI
分类号 C08J5/24;B32B15/08;B32B18/00;C08G59/40;C08K3/24;C08L63/00;C08L101/00;H05K1/03;(IPC1-7):C08J5/24 主分类号 C08J5/24
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