发明名称 Method for forming buried layers with top-side contacts and the resulting structure
摘要 A buried layer of dopant is formed in a semiconductor by etching a series of trenches, then depositing dopant at the bottom of the trenches and diffusing until the dopant from different trenches meet to form a continuous layer. Depending on the material used to fill the trenches, the buried layer can be contacted or isolated. With this method, it becomes unnecessary to grow expensive epitaxial layers.
申请公布号 US6316336(B1) 申请公布日期 2001.11.13
申请号 US20000516009 申请日期 2000.02.29
申请人 BLANCHARD RICHARD A. 发明人 BLANCHARD RICHARD A.
分类号 H01L21/74;H01L21/761;H01L21/762;H01L21/763;(IPC1-7):H01L21/36 主分类号 H01L21/74
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