发明名称 |
MOLD FOR MOLDING RESIN, RESIN MOLDING, AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold for molding a resin without generating a gate residue by using a PS resin containing a silicon even when the resin is molded in a pin gate type mold. SOLUTION: The pin gate type mold for molding the resin molds a molding having a volume of 0.5 to 2.5 cm3 by using the PS resin containing the silicon. In this case, a gate diameter of the gate is set to 0.4 to 0.6 mm, and a land length of the gate is set to substantially 0 mm.
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申请公布号 |
JP2001315170(A) |
申请公布日期 |
2001.11.13 |
申请号 |
JP20000135725 |
申请日期 |
2000.05.09 |
申请人 |
KONICA CORP |
发明人 |
YAMAZAKI MASARU;OKUBO HITOSHI |
分类号 |
G03C3/00;B29C45/26;(IPC1-7):B29C45/26 |
主分类号 |
G03C3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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