发明名称 MOLD FOR MOLDING RESIN, RESIN MOLDING, AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a mold for molding a resin without generating a gate residue by using a PS resin containing a silicon even when the resin is molded in a pin gate type mold. SOLUTION: The pin gate type mold for molding the resin molds a molding having a volume of 0.5 to 2.5 cm3 by using the PS resin containing the silicon. In this case, a gate diameter of the gate is set to 0.4 to 0.6 mm, and a land length of the gate is set to substantially 0 mm.
申请公布号 JP2001315170(A) 申请公布日期 2001.11.13
申请号 JP20000135725 申请日期 2000.05.09
申请人 KONICA CORP 发明人 YAMAZAKI MASARU;OKUBO HITOSHI
分类号 G03C3/00;B29C45/26;(IPC1-7):B29C45/26 主分类号 G03C3/00
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