发明名称 Manual electronic-part mounting apparatus and method
摘要 A manual electronic-part mounting apparatus includes a manual adhesive coating apparatus, a manual electronic-part fitting apparatus, and a manual printed-wiring-board checking apparatus. The manual adhesive coating apparatus has a pressing plate portion to which a large number of needles are fitted, being arranged such that the needles with the adhesive are brought in contact with a printed-wiring board, thereby the adhesive being coated on predetermined positions of the printed-wiring board. The manual electronic-part fitting apparatus has a large number of electronic-part supply rods. The electronic-part supply rod has an electronic-part storage rod supported by a fixed plate and an extruding rod supported by a movable plate. When the movable plate is moved relative to the fixed plate, the chip-type electronic part is extruded from an end-portion side aperture of the electronic-part storage rod.
申请公布号 US6315024(B1) 申请公布日期 2001.11.13
申请号 US19990285569 申请日期 1999.04.02
申请人 SONY CORPORATION 发明人 SUGIYAMA OSAMU
分类号 H05K3/34;H05K3/30;H05K13/04;H05K13/08;(IPC1-7):B65C9/08 主分类号 H05K3/34
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