| 摘要 |
PROBLEM TO BE SOLVED: To solve problems of conventional one-pack thermosetting epoxy resin compositions such as a high curing temperature and a long curing time when a latent curing agent is employed, difficulty in obtaining a microcapsule excellent in rupture characteristics, necessity of homogeneous pressurization for a pressure-rupture type microcapsure, unsharpness of temperature sensitivity characteristics for a temperature-rupture type microcapsule when a microcapsulated curing agent is employed, and the like. SOLUTION: The low-temperature fast curable epoxy resin composition which can be compounded into one-pack composition comprises an epoxy resin and, incorporated therewith, a thiopropionate and/or a thioglycolate as a curing agent, a tertiary amine adduct-based latent curing accelerator as a curing accelerator and a borate and a phenolic resin as preservation stabilizers.
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