发明名称 HEATING MECHANISM OF VACUUM LAMINATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To solve problems encountered in the prior art that in a connecting method using plural electric cables a large accommodation space and a large scale equipment are necessitated since a thick electric cable is necessary for sending as large as several hundreds ampere electric current and a longer cable is necessary for permitting elongation due to heat expansion of a hot plate and that in a connecting method using a brush or a screw there occurs ununiform temperature distribution of a board surface of a hot plate due to variation of heat generation brought by variation of electric resistance since contact pressure at a contact portion is liable to become deficient or ununiform to cause excessiveness or a change of electric resistance, the ununiform temperature distribution being caused also by heat radiation from a conductor at an edge of a hot plate. SOLUTION: Sending an electric current to a hot plate is conducted by means of plural contact terminals composed of laminated thin metal plates and further a temperature of a conductor is controlled.
申请公布号 JP2001315202(A) 申请公布日期 2001.11.13
申请号 JP20000203994 申请日期 2000.07.05
申请人 MEIKI CO LTD 发明人 OGAWA AKIHIKO
分类号 B29C63/02;(IPC1-7):B29C63/02 主分类号 B29C63/02
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