发明名称 MOLD CLAMPING APPARATUS AND CONTROL METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To solve such a problem that the deterioration of the degree of parallelization of molds, that is, the thickness irregularity of a molded article is easy to generate in a direct pressure type mold clamping apparatus though there are many beneficial points from an aspect of molding in this apparatus. SOLUTION: The mold clamping apparatus is constituted of a mold clamping mechanism for allowing mold clamping force to act on the center part of a movable platen, a plurality of auxiliary clamping mechanisms for allowing mold clamping force to act across the movable platen and a fixed platen, detectors for detecting the distance between the movable platen and the fixed platen corresponding to the auxiliary clamping mechanisms, and a control unit for controlling the auxiliary clamping mechanisms so that the signals from the detectors become equal.
申请公布号 JP2001315130(A) 申请公布日期 2001.11.13
申请号 JP20000133654 申请日期 2000.05.02
申请人 MEIKI CO LTD 发明人 MORITA RYOZO;SHINODA TAKASHI
分类号 B29C33/22;B29C45/64;B29C45/80;(IPC1-7):B29C33/22 主分类号 B29C33/22
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