Cooling system for electronic components in an equipment enclosure

摘要

A direct flow impingement cooling system for heat generating electronic components is disclosed. The system includes a panel containing the components and the panel is formed of a main housing and a cover housing hinged to move between opened and closed positions. Three fans are positioned downstream of three spiral shaped air intake patterns, each having 18 cone-shaped cutouts. Downstream of the fans is a back plate with three aligned openings and side wall air exhaust slots. Downstream of the slots are upper and side exhaust openings, where all of the openings provide for low impedance air flow such that high heat removal from densely packed components is achieved.