| 摘要 |
A manufacturing method for a silicon substrate having a recess and an ink jet head, as well as the silicon substrate and the ink jet head. A silicon substrate having recesses is manufactured by a method providing for increased precision, resolution, and reduced size by wet oxidation of the silicon substrate to form a thermal oxidation film as the mask used for recess etching, etching recesses into the silicon substrate using as the mask the thermal oxidation film formed by wet oxidation, removing the thermal oxidation film formed in the masking process after etching is completed, then forming a protective film on the silicon substrate by dry oxidation of the substrate after removing the mask. The resulting silicon substrate can be used to manufacture an ink jet head in which the etched recesses form diaphragms and ink nozzles, the protective film provides high resistance to corrosion by ink, and reduced power consumption can be achieved.
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