发明名称 METHOD FOR MANUFACTURING ELECTRONIC EQUIPMENT HOUSING
摘要 PROBLEM TO BE SOLVED: To produce an electronic equipment housing made of a metal plate and a thermoplastic resin by composite molding by a method for manufacturing with a high productivity. SOLUTION: A laminating method has the steps of pretreating 102 such as degreasing, coating and conversion treating or the like a coil original plate 100 or a sheet original plate 101 in an original plate process, then coating the plate 100 or the plate 101 with an adhesive 103, laminating 105 a thermoplastic resin film 104 on its surface, thereby manufacturing a laminated original plate 106. Meanwhile, a precoating method has the steps of coating 109 the plate with a thermoplastic resin 108 in an original plate process, and baking the plate in an oven 110, thereby obtaining a precoated original plate 111. In a component processing step, the laminated original plate or the precoated original plate manufactured in the original plate process is metal press molded in a multi-cavity mold, thereby manufacturing a plurality of object metal components. Thus, an integrally efficient production of thermally welding of an in-mold resin to the coil original plate of multiple sizes or the sheet original plate, processing the pressed component from the original plate, and in-mold molding can be performed.
申请公布号 JP2001315162(A) 申请公布日期 2001.11.13
申请号 JP20000142282 申请日期 2000.05.10
申请人 HITACHI LTD 发明人 ISHIKAWA TETSUO;SOMA TOMOYUKI
分类号 B21D22/20;B21D28/00;B29C45/14;B32B15/08;H05K5/02;(IPC1-7):B29C45/14 主分类号 B21D22/20
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