发明名称 Semiconductor device having capacitive element structure and multilevel interconnection structure and method of fabricating the same
摘要 A capacitive element structure in a semiconductor device having an interconnection structure. The capacitive element structure includes a capacitive element having a capacitive dielectric film made of an oxide compound. The capacitive element structure is above at least a first level interconnection of the interconnection structure.
申请公布号 US6316801(B1) 申请公布日期 2001.11.13
申请号 US19990262070 申请日期 1999.03.04
申请人 NEC CORPORATION 发明人 AMANUMA KAZUSHI
分类号 H01L21/02;H01L21/768;H01L21/8242;(IPC1-7):H01L27/108 主分类号 H01L21/02
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