| 摘要 |
A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embodiment of the probe includes a probe tip which is held on an extension arm projecting laterally from an elongated flat spring. The spring is supported above a substrate by posts such that the probe tip moves vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and torsional flexure of the sheet spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar. |
