| 摘要 |
The invention relates to a polymeric composition for packaging a semiconductor electronic device comprising: a) at least one epoxy resin, b) at least one curing agent, in an amount comprised between 30 and 110 parts by weight per 100 parts by weight of epoxy resin, c) at least one silica-based reinforcing filler, in an amount comprised between 300 and 2300 parts by weight per 100 parts of epoxy resin, d) at least one control agent for the rheology of the polymeric composition, substantially free from polar groups, in an amount comprised between 0.1 and 50 parts by weight per 100 parts by weight of epoxy resin. The invention also relates to a packaging of plastic material for microelectronic applications, which can be obtained starting from the aforesaid polymeric composition, and to a semiconductor electronic device comprising said packaging. <IMAGE> |
