| 摘要 |
PURPOSE:To provide a machine for forming the lead of a semiconductor device which can form the outer lead always in uniform shape without doing damage to the plated face of the outer lead. CONSTITUTION:This machine is equipped with a chuck part 21, which catches a semiconductor device in erection state through the margin of a package, a plurality of claws 17, which are arranged capably of advance into the space being formed on the base side of an outer lead, to the semiconductor device being caught with the chuck part 21, variable mechanisms 25-29, which vary the relative position between the chuck part 21 and the claws 17 in the direction of erection of the semiconductor device, and a forming head 12, which is supported shiftably in the direction of erection of the semiconductor device and on the side of whose tip a groove for opening the lead capable of engaging each with an outer lead is made. |
