发明名称 |
Methods for connecting flexible circuit substrates to contact objects and structures thereof |
摘要 |
<p>A connecting method comprising laminating a flexible circuit substrate having a plurality of bump contacts with a contact object having a plurality of portions to be contacted such that the respective bump contacts face to the portions to be contacted at a joined surface, correspondingly each other to form a laminate, and applying pressure to the entire surface of the laminate in a compressing direction with pressurizing means provided so as to pinch the laminate in a laminating direction to contact the plural bump contacts mounted on the flexible circuit substrate with the plural portions to be contacted corresponding thereto mounted on the contact object, respectively. <IMAGE></p> |
申请公布号 |
EP0641038(B1) |
申请公布日期 |
2001.11.07 |
申请号 |
EP19940113337 |
申请日期 |
1994.08.25 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
YAMAMOTO, YASUHIKO;OHKI, ISAO;YOSHIDA, JUNJI;YAMASHITA, HIDEO;OUCHI, KAZUO;KANETO, MASAYUKI |
分类号 |
G01R1/073;H01L21/60;H01R4/00;H01R4/04;H01R12/62;H01R13/24;H01R43/00;H05K3/36;(IPC1-7):H01R12/38 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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