发明名称 |
Emi and rfi shielding for printed circuit boards |
摘要 |
The present invention provides a vacuum deposited metal layer that can shield the electronic components on a PCB or FPC. The vacuum metallized conductive layer can be grounded to a ground trace on the circuit board to create a Faraday cage to protect the electronic components disposed on the circuit board from EMI. The metallized conductive layer can be disposed over an encapsulating insulative layer or onto a shaped thermoform or mold injected plastic substrate that is coupled to the PCB or FPC. |
申请公布号 |
AU4787901(A) |
申请公布日期 |
2001.11.07 |
申请号 |
AU20010047879 |
申请日期 |
2001.03.28 |
申请人 |
SHIELDING FOR ELECTRONICS, INC. |
发明人 |
JESUS AL ORTIZ;ROCKY R. ARNOLD |
分类号 |
H01R13/6599 |
主分类号 |
H01R13/6599 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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