| 发明名称 |
ADHESION-RESISTANT OXYGEN-FREE COPPER WIRE ROD |
| 摘要 |
PURPOSE: An adhesion-resistant oxygen-free copper roughly drawn wire not being adhered to each other and being mass-produced at low cost is provided. CONSTITUTION: The adhesion-resistant oxygen-free copper roughly drawn wire(1) contains oxygen in concentration of 1 to 10 ppm and hydrogen in concentration of 1 ppm or less and having a gross oxidation film(5) 50 to 500Å in thickness with an oxidation film of Cu2O(7) being present in a part of said gross oxidation film(5).
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| 申请公布号 |
KR20010096590(A) |
申请公布日期 |
2001.11.07 |
| 申请号 |
KR20010012228 |
申请日期 |
2001.03.09 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
HATTORI YOSHIAKI;HORI KAZUMASA;KOSHIBA YUTAKA;MASUI TUTOMU |
| 分类号 |
B22D1/00;B22D11/00;B22D11/06;B22D11/106;B22D11/11;B22D11/113;B22D11/118;C22B15/00;C22C9/00;H01B5/02;H01B13/00;(IPC1-7):B22D11/06 |
主分类号 |
B22D1/00 |
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