发明名称 METHOD FOR MEASURING GRAIN SIZE OF METAL FILM USING PARTICLE MEASURING EQUIPMENT
摘要 PURPOSE: A grain size measurement method of a metal film is provided to quickly analyze grain state of the metal film by measuring a reflectivity of the metal film using a particle measuring equipment. CONSTITUTION: A laser beam is irradiated into a wafer deposited a metal film by a rotation or a line scan methods using a particle measuring equipment. By analyzing only a noise signal among the detected signals, the reflectivity of the metal film is measured two-dimensionally, thereby measuring the grain size of the metal film. At this time, aluminum having a high conductivity is used as the metal film.
申请公布号 KR20010095474(A) 申请公布日期 2001.11.07
申请号 KR20000016536 申请日期 2000.03.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO, HYEONG SEOK;HYUN, PIL SIK
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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