DEVICE FOR MEASURING RESIDUAL STRESS OF LEAD FRAME MATERIAL

摘要

PURPOSE: A residual stress measuring device for a lead frame material is provided to determine the reject of a lead frame according to the size and distribution of residual stress detected in response to the change of flux, thereby preventing the deviation of a semiconductor chip from a position when the semiconductor chip is mounted on the reject lead frame. CONSTITUTION: A residual stress measuring device for a lead frame material includes a sensor probe(16) for generating a magnetic flux for measuring a residual stress of a magnetic conductive material for lead frame, a signal generating part(90) for generating a predetermined measurement signal to be applied to the sensor probe for detecting a change of the magnetic flux according to the residual stress, a signal conversion part for detecting a magnetic flux signal input to the sensor probe by the contact between the sensor probe and the lead frame to convert the signal to an electric signal, and a main control part(120) for detecting the size and distribution of the residual stress of the lead frame according to the magnetic flux signal output from the signal conversion part and the change of input magnetic flux to determine the quality of the lead frame.