SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING IT

摘要

PURPOSE: To provide a semiconductor device and a method of manufacturing it wherein the number of manufacturing processes can be reduced and necessary masking materials can be reduced with respect to the semiconductor device having a fuse. CONSTITUTION: For an oxide film 21c as an upper part insulating layer, when forming an opening part for a contact wiring 22c, the oxide film 21c including a fuse region 26 is removed. Further, the contact wiring 22c that connects wiring layers 23b, 23c above and below the oxide film 21c electrically and the wiring laver 23c that should be located in the upper part of the oxide film 21c are formed as one upper part conducting layer 25 simultaneously.