发明名称 |
Method for plasma treatment |
摘要 |
A substrate (101) subjected to a plasma process is placed on a first electrode (102). A magnetic field is applied to a surface of the substrate to which the plasma process is applied by magnetic field applying means (103). An auxiliary electrode (104) is provided on an outer periphery of the first electrode (102) to excite plasma on a back surface (105) thereof. Electrons in the plasma are caused to drift from a front surface (106) to a back surface (105) of the auxiliary electrode (104) and from the back surface (105) to the front surface (106) of the auxiliary electrode (104). <IMAGE>
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申请公布号 |
EP1152646(A1) |
申请公布日期 |
2001.11.07 |
申请号 |
EP20000977871 |
申请日期 |
2000.11.22 |
申请人 |
TOKYO ELECTRON LIMITED;OHMI, TADAHIRO |
发明人 |
OHMI, TADAHIRO;HIRAYAMA, MASAKI;KAIHARA, RYUU |
分类号 |
H01L21/302;H01J37/32;H01L21/3065;H05H1/46;(IPC1-7):H05H1/46;H01L21/306 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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