发明名称 POLYESTER RESIN SHEET AND MOLDINGS THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a polyester resin sheet and moldings thereof which are suitably used for packaging or transporting of electronic equipment parts. SOLUTION: The resin composition comprises a polyester-based resin (a) having an ethylene terephthalate unit as the main components and a polyolefin- based resin and/or a polyamide-based resin (b), and the ratio of component (b) to the amount of sum totals of components (a) and (b) is 0.1 ppb-10 wt.%.
申请公布号 JP2001310992(A) 申请公布日期 2001.11.06
申请号 JP20000129271 申请日期 2000.04.28
申请人 MITSUBISHI CHEMICALS CORP 发明人 KAWAKAMI KAZUMI;YOSHITOKU HIROO
分类号 B65D85/86;B29C51/00;C08J5/00;C08J5/18;C08L67/02;(IPC1-7):C08L67/02 主分类号 B65D85/86
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