发明名称 |
POLYESTER RESIN SHEET AND MOLDINGS THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyester resin sheet and moldings thereof which are suitably used for packaging or transporting of electronic equipment parts. SOLUTION: The resin composition comprises a polyester-based resin (a) having an ethylene terephthalate unit as the main components and a polyolefin- based resin and/or a polyamide-based resin (b), and the ratio of component (b) to the amount of sum totals of components (a) and (b) is 0.1 ppb-10 wt.%.
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申请公布号 |
JP2001310992(A) |
申请公布日期 |
2001.11.06 |
申请号 |
JP20000129271 |
申请日期 |
2000.04.28 |
申请人 |
MITSUBISHI CHEMICALS CORP |
发明人 |
KAWAKAMI KAZUMI;YOSHITOKU HIROO |
分类号 |
B65D85/86;B29C51/00;C08J5/00;C08J5/18;C08L67/02;(IPC1-7):C08L67/02 |
主分类号 |
B65D85/86 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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