发明名称 |
Method for COB mounting of electronic chips on a circuit board |
摘要 |
A method for COB mounting of electronic chips on a circuit board includes contact connection of connecting wires and substantially whole-area adhesive bonding of a housing. A chip is partially adhesively bonded on a circuit board in such a way that the chip can be contact-connected and can be removed again without damage to the circuit board. Electronic tests or a burn-in process is performed on the chip. The chip, with a given functionality in a manner that is required for application of the circuit board, is fully adhesively bonding.
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申请公布号 |
US6312962(B1) |
申请公布日期 |
2001.11.06 |
申请号 |
US20000566936 |
申请日期 |
2000.05.08 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
M&UUML,NCH THOMAS;POHL JENS;WUTZ OLIVER |
分类号 |
H01L21/58;(IPC1-7):H01L21/66;G01R31/26 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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