发明名称 |
Pressure sensor component |
摘要 |
The pressure sensor component has a chip carrier carrying a semiconductor chip with an integrated pressure sensor having a pressure-detecting surface exposed to the pressure to be measured. A device encapsulation made from an electrically insulating material surrounds the entire assembly except for protruding electrode terminals. Bond wires connect the electrode terminals with the pressure sensor and/or the electronic circuit of the semiconductor chip. The device encapsulation consists entirely of a homogeneous pressure-transmitting medium comprising an enveloping compound, which transmits the pressure to be measured as free from delay and attenuation as possible but is mechanically resistant and dimensionally stable. The pressure to be measured is transmitted directly by the enveloping compound onto the pressure-detecting surface of the semiconductor chip, and the pressure sensor and/or the pressure sensor component is covered tightly on all sides against mechanical and/or chemical influences.
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申请公布号 |
US6313514(B1) |
申请公布日期 |
2001.11.06 |
申请号 |
US19980093336 |
申请日期 |
1998.06.08 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
WINTERER JüRGEN;BOOTZ ERIC;STADLER BERND;NEU ACHIM;JANCZEK THIES |
分类号 |
B81B7/00;G01L9/00;(IPC1-7):H01L29/82 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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