| 摘要 |
A method of manufacturing a field emission element including the steps of: depositing an emitter electrode film on the surface of an emitter portion forming recess formed on a substrate; forming an emitter portion of an emitter electrode by removing the emitter electrode film deposited on the bottom of the emitter portion forming recess; depositing a sacrificial film on the surface of the emitter electrode and on the bottom of the emitter portion forming recess, and thereafter depositing a second gate electrode film on the surface of the sacrificial film. With this manufacture method, field emission elements having small unevenness in vertical positions of emitter and gate electrodes can be formed.
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