| 摘要 |
Apparatus and methods for cooling integrated circuit boards and electronic components by providing internal passageways in the components and circuit boards which connect to a fluid manifold. The internal passageways connect to a plurality of other passageways so that fluid can be applied to the surface of the components. A cooling fluid capable of phase change is supplied to the internal passageways to conductively cool the interior of the component and to flow through the other passageways to cool the surface of the component at least partially by evaporative cooling. A plurality of circuit boards can be placed back to back with the fluid manifold therebetween, both of which are in an enclosed space so that cooling fluid can be supplied through the fluid manifold to the integrated circuit boards and to the individual components for cooling both the circuit boards and the electronic components.
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