发明名称 METHOD FOR MANUFACTURING PARTICLE BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a particle board wherein a nozzle cracking phenomenon is prevented from being generated in a peripheral part of a nail through hole in execution, and durability and an adhesive property of a resin sheet to be used for covering front and rear faces are improved. SOLUTION: In the method for manufacturing the particle board comprising wood material, the method for manufacturing the particle board comprises a process wherein a board-like body 8 comprising the wood material is formed, and its front and rear faces are covered by a first resin sheet 41; a process wherein the board-like body 8 is heated and pressurized; a process wherein a front face of the first resin sheet 41 is covered by a second resin sheet 42; and a process wherein the board-like body 8 is heated and pressurized.</p>
申请公布号 JP2001310311(A) 申请公布日期 2001.11.06
申请号 JP20000127864 申请日期 2000.04.27
申请人 NICHIHA CORP 发明人 AIZAWA HIDEO;YABE TOMOYOSHI
分类号 B27M3/00;B27N3/06;B32B21/08;B32B37/10;(IPC1-7):B27N3/06;B32B31/20 主分类号 B27M3/00
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